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Model Number : SLTJ-5040
Substrate thickness : 0.075-1.5mm(base on material)
MOQ : 1
Material of punch die : SKD11/61 quenched
Supply Ability : 30 sets per month
Precision : ±0.015mm
Brand Name : SILITRON
Place of Origin : China
Payment Terms : T/T
Packaging Details : L1800mm x W1600mm x H1450mm
Color : Grey
Certification : CE
Application
It's widely used for PET, PC, PVC, IMI/IMD, flexible circuits, films, photoplates, polyester, mobile phone panels, mobile phone keypads, aluminum substrates, thin aluminum sheets, nameplates, polycarbonate, membrane switches, decals, vehecle panel, keyboards, dials, demos, heat transfer label, front panel, flex printed circuits, medical labels, graphic overlays, self-adhesive label, membrane keyboard, and other thin materials.
Punching Samples

Product Features
Technical Parameters
| Model | SLTJ-5040 |
|
Hole diameter |
Φ1 mm-Φ5mm(customizable) |
|
Max material size |
500*400mm |
|
Max punching force |
7kN |
|
Multiple light sources |
white & colors |
|
Punching precision |
±0.015mm |
|
Material thickness |
0.1-1.2mm(depend on material) |
|
Punching speed |
0.35s/hole(exclude loading & unloading time) |
|
Power |
1.5KW |
|
Voltage |
AC200V~240V |
|
Dimension |
L1620mm x W1420mm x H1300mm |
|
Weight |
550kg |
|
Storage height |
200 mm |

Main Components
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CCD Automatic Guide Hole Punching Machine for Electronic Materials Images |